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  november 2004 / original 1 semiconductor tak cheong ? 500 mw do-34 hermetically sealed glass zener voltage regulators absolute maximum ratings t a = 25c unless otherwise noted parameter value units power dissipation 500 mw storage temperature range -65 to +200 c operating junction temperature +175 c lead temperature (1/16? from case for 10 seconds) 230 c these ratings are limiting values above which the serviceability of the diode may be impaired. specification features: ? zener voltage range 2.0 to 39 volts ? do-34 package (jedec do-204) ? through-hole device type mounting ? hermetically sealed glass ? compression bonded construction ? all external surfaces are corrosion resistant and leads are readily solderable ? cathode indicated by polarity band electrical characteristics t a = 25c unless otherwise noted vz@izt device type t tolerance min nom max izt (ma) zzt@izt (ohms) max zzk@izk (ohms) max izk (ma) i r @ v r (ua) max v r (v) a 5.5% 1.880 1.990 2.100 tcmtzj2v0 b 4.3% 2.020 2.110 2.200 5 100 1000 0.5 120 0.5 a 4.0% 2.120 2.210 2.300 tcmtzj2v2 b 4.1% 2.220 2.315 2.410 5 100 1000 0.5 100 0.7 a 3.9% 2.330 2.425 2.520 tcmtzj2v4 b 4.0% 2.430 2.530 2.630 5 100 1000 0.5 120 1.0 a 4.0% 2.540 2.645 2.750 tcmtzj2v7 b 3.9% 2.690 2.800 2.910 5 110 1000 0.5 100 1.0 a 3.7% 2.850 2.960 3.070 tcmtzj3v0 b 3.4% 3.010 3.115 3.220 5 120 1000 0.5 50 1.0 a 3.4% 3.160 3.270 3.380 tcmtzj3v3 b 3.1% 3.320 3.425 3.530 5 120 1000 0.5 20 1.0 a 3.6% 3.455 3.575 3.695 tcmtzj3v6 b 3.3% 3.600 3.723 3.845 5 100 1000 1 10 1.0 a 3.5% 3.740 3.875 4.010 tcmtzj3v9 b 3.3% 3.890 4.025 4.160 5 100 1000 1 5 1.0 a 3.0% 4.040 4.165 4.290 b 3.0% 4.170 4.300 4.430 tcmtzj4v3 c 3.0% 4.300 4.435 4.570 5 100 1000 1 5 1.0 tcmtzjxxx series cathode anode electrical symbol axial lead do34 l =tak cheong logo xxx =device code tcmtzjxxx t (tolerance) =a, b, c or d band color =black device marking diagram l xxx t
november 2004 / original 2 semiconductor tak cheong ? electrical characteristics t a = 25c unless otherwise noted v z @izt device type t tolerance min nom max izt (ma) zzt@izt (ohms) max zzk@izk (ohms) max izk (ma) i r @v r (ua) max v r (v) a 2.6% 4.44 4.56 4.68 b 2.8% 4.55 4.68 4.80 tcmtzj4v7 c 2.7% 4.68 4.81 4.93 5 80 900 1 5 1.0 a 2.6% 4.81 4.94 5.07 b 2.6% 4.94 5.07 5.20 tcmtzj5v1 c 2.7% 5.09 5.23 5.37 5 80 800 1 5 1.5 a 2.4% 5.28 5.41 5.55 b 2.5% 5.45 5.59 5.73 tcmtzj5v6 c 2.6% 5.61 5.76 5.91 5 60 500 1 5 2.5 a 2.7% 5.78 5.94 6.09 b 2.6% 5.96 6.12 6.27 tcmtzj6v2 c 2.5% 6.12 6.28 6.44 5 60 300 1 5 3.0 a 2.6% 6.29 6.46 6.63 b 2.6% 6.49 6.66 6.83 tcmtzj6v8 c 2.6% 6.66 6.84 7.01 5 20 150 0.5 2 3.5 a 2.7% 6.85 7.04 7.22 b 2.6% 7.07 7.26 7.45 tcmtzj7v5 c 2.5% 7.29 7.48 7.67 5 20 120 0.5 0.5 4.0 a 2.6% 7.53 7.73 7.92 b 2.6% 7.78 7.99 8.19 tcmtzj8v2 c 2.5% 8.03 8.24 8.45 5 20 120 0.5 0.5 5.0 a 2.6% 8.29 8.51 8.73 b 2.5% 8.57 8.79 9.01 tcmtzj9v1 c 2.6% 8.83 9.07 9.30 5 25 120 0.5 0.5 6.0 a 2.6% 9.12 9.36 9.59 b 2.6% 9.41 9.66 9.90 c 2.5% 9.70 9.95 10.20 tcmtzj10v d 2.5% 9.94 10.19 10.44 5 30 120 0.5 0.2 7.0 a 2.6% 10.18 10.45 10.71 b 2.6% 10.50 10.78 11.05 tcmtzj11v c 2.5% 10.82 11.10 11.38 5 30 120 0.5 0.2 8.0 a 2.5% 11.13 11.42 11.71 b 2.6% 11.44 11.74 12.03 tcmtzj12v c 2.6% 11.74 12.05 12.35 5 30 110 0.5 0.2 9.0 a 2.6% 12.11 12.43 12.75 b 2.6% 12.55 12.88 13.21 tcmtzj13v c 2.6% 12.99 13.33 13.66 5 35 110 0.5 0.2 10 a 2.5% 13.44 13.79 14.13 b 2.6% 13.89 14.26 14.62 tcmtzj15v c 2.5% 14.35 14.72 15.09 5 40 110 0.5 0.2 11 a 2.6% 14.80 15.19 15.57 b 2.6% 15.25 15.65 16.04 tcmtzj16v c 2.5% 15.69 16.10 16.51 5 40 150 0.5 0.2 12 a 2.5% 16.22 16.64 17.06 b 2.5% 16.82 17.26 17.70 tcmtzj18v c 2.6% 17.42 17.88 18.33 5 45 150 0.5 0.2 13 a 2.5% 18.02 18.49 18.96 b 2.5% 18.63 19.11 19.59 c 2.5% 19.23 19.73 20.22 tcmtzj20v d 2.5% 19.72 20.22 20.72 5 55 200 0.5 0.2 15
november 2004 / original 3 semiconductor tak cheong ? electrical characteristics t a = 25c unless otherwise noted v z @izt device type t tolerance min nom max izt (ma) zzt@izt (ohms) max zzk@izk (ohms) max izk (ma) i r @v r (ua) max v r (v) a 2.2% 20.15 20.68 21.20 b 2.5% 20.64 21.18 21.71 c 2.5% 21.08 21.63 22.17 tcmtzj22v d 2.5% 21.52 22.08 22.63 5 30 200 0.5 0.2 17 a 2.5% 22.05 22.62 23.18 b 2.5% 22.61 23.19 23.77 c 2.5% 23.12 23.72 24.31 tcmtzj24v d 2.5% 23.63 24.24 24.85 5 35 200 0.5 0.2 19 a 2.5% 24.26 24.89 25.52 b 2.5% 24.97 25.62 26.26 c 2.5% 25.63 26.29 26.95 tcmtzj27v d 2.5% 26.29 26.97 27.64 5 45 250 0.5 0.2 21 a 2.5% 26.99 27.69 28.39 b 2.5% 27.70 28.42 29.13 c 2.5% 28.36 29.09 29.82 tcmtzj30v d 2.5% 29.02 29.77 30.51 5 55 250 0.5 0.2 23 a 2.5% 29.68 30.45 31.22 b 2.5% 30.32 31.10 31.88 c 2.5% 30.90 31.70 32.50 tcmtzj33v d 2.5% 31.49 32.30 33.11 5 65 250 0.5 0.2 25 a 2.5% 32.14 32.97 33.79 b 2.5% 32.79 33.64 34.49 c 2.5% 33.40 34.27 35.13 tcmtzj36v d 2.5% 34.01 34.89 35.77 5 75 250 0.5 0.2 27 a 2.5% 34.68 35.58 36.47 b 2.5% 35.36 36.28 37.19 c 2.5% 36.00 36.93 37.85 tcmtzj39v d 2.5% 36.63 37.58 38.52 5 85 250 0.5 0.2 30 vf (forward voltage) = 1.2 v maximum @ if = 200ma for all types note: 1. the zener voltage subdivision (vz) is measured 40ms after diode is powered up. 2. the operating resistance (zzt and zzk) is measured by superimposing a minute alternation current in the regulated current (iz). 3. when ordering, please specify tolerance a, b, c or d. electrical symbol definition typical characteristics symbol parameter vz reverse zener voltage @ i z t i zt reverse current z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i z k i r reverse current @ v r v r breakdown voltage i f forward current v f forward voltage @ i f v i (mv) (v) (ma) ( a) v i f b v i r i r v r (na)
november 2004 / original 4 semiconductor tak cheong ? ordering information device package quantity tcmtzjxxxt bulk 10,000 tcmtzjxxxt.tb tape and ammo 5,000 tcmtzjxxxt.tr tape and reel 10,000 tcmtzjxxxt others (?contact tak cheong sales representatives) axial-lead tape packaging standards this axial-lead component?s packaging requirements use in autom atic testing and assembly equipment. and this standard practices for lead-tape packaging of axial-lead components meets the requirements of eia standard rs-296-d ?lead-taping of components on axia l lead configuration for automatic insertion?.
november 2004 / original 5 semiconductor tak cheong ? tape & reel packaging information tape & reel outline reel dimensions quantity per reel package type quantity per reel do-34 10,000 tape & ammo packaging information corrugated outer liner write (anode) red or blue (cathode) kraft paper wound b etween la y ers dim millimeters d1 356 d2 30 d3 84 d4 77.5 label
november 2004 / original 6 semiconductor tak cheong ? tape & ammo outline quantity per ammo box package type quantity per reel do-34 5,000 taping dimension bulk packaging information 250mm x 80mm x 80mm desceription millimeters standard width 52 26 tape spacing (b) 52 0.69 26+0.5/-0 component pitch (c) 5.08 0.4 5.08 0.4 untaped lead (l1-l2) 0.69 0.69 glass offset (f) 0.69 0.69 bent (d) 1.2 max 1.2 max tape width (g) 6.138 0.576 6.138 0.576 tape mismatch (e) 0.55 max 0.55 max taped lead (g) 3.2 min 3.2 min lead beyond tape (h) 0 0
november 2004 / original 7 semiconductor tak cheong ? bulk outline quantity per box package type quantity per reel do-34 10,000 package outline 190mm x 150mm x 65mm quantity per plastic bag do-34 500 x 20 plastic bags plastic bag
november 2004 / original 8 semiconductor tak cheong ? package case outline do-34 do-34 millimeters inches dimension min max min max a 0.46 0.55 0.018 .0022 b 2.16 3.04 0.085 0.120 c 25.40 38.10 1.000 1.500 d 1.27 1.90 0.050 0.075 note: 1.0 all dimensions are within jedec standard. 2.0 do-34 polarity denoted by cathode band.


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